1 / 4 www.asb.co.kr a ugust 2017 p lerow tm aln2575t1 internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs , phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple an d convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 2560 2590 gain db 22.5 23.5 gain flatness db ? 0.2 ? 0.3 noise figure db 0.80 0.85 output ip3 (1) dbm 30 31 s11 / s22 (2) db - 18 / - 10 output p1db dbm 14 15 switching time (3) ? sec - supply current ma 7 0 8 0 supply voltage v 3 impedance ? 50 package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 0 dbm / tone separ ated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc other s ground ou t line drawing (unit: mm) feature s s 21 = 2 3.7 db @ 2560 mhz = 2 3.3 db @ 2590 mhz nf of 0.80 db over frequency unconditionally stable single 3v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grou nding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description (recommended footprint) aln2 575t1 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 2 - stage single type specifications (in pr o duction) typ. @ t = 25 ? c, v s = 3 v, freq. = 2575 mhz, z o.sys = 50 ohm
2 / 4 www.asb.co.kr a ugust 2017 p lerow tm aln2575t1 internally matched lna module s - parameters noise figure oip3 p1db 2560~2590 mhz +3 v typical performan ce (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr a ugust 2017 p lerow tm aln2575t1 internally matched lna module item voltage s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) 2.5 - 13.32 - 11.78 22.46 0.14 0.932 14.72 24.54 22 2.6 - 14.95 - 11.48 23.20 0.15 0.853 14.68 25.75 28 2.7 - 16.73 - 11.17 23.74 0.14 0.805 14.82 27.54 35 2.8 - 18.28 - 10.94 24.15 0.16 0.771 15.21 29.41 42 2.9 - 19.49 - 10.68 24.47 0.15 0.756 15.60 30.89 50 3 .0 - 20.22 - 10.47 24.64 0.16 0.770 16.08 3 2.10 58 3.1 - 20.63 - 10.27 24.84 0.17 0.765 16.28 33.21 68 3.2 - 20.56 - 10.06 24.96 0.18 0.763 16.63 33.54 78 3.3 - 20.30 - 9.92 25.06 0.16 0.776 16.91 34.18 88 3.4 - 19.91 - 9.75 25.10 0.17 0.791 17.20 34.10 99 3.5 - 19.36 - 9.62 25.11 0.19 0.807 17.42 33.98 109 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 ? c - 18.39 - 10.38 24.80 0.15 0.493 15.47 30.71 50 - 20 ? c - 18.93 - 10.73 24.72 0.12 0.569 15.56 31.35 53 0 ? c 19.54 - 10.63 24.70 0.15 0.652 15.54 31.74 54 25 ? c - 20.29 - 10.68 24.49 0.17 0.776 15.69 32.10 59 40 ? c - 20.66 - 10.55 24.51 0.16 0.840 15.66 32.11 60 60 ? c - 20.81 - 10.60 24.41 0.18 0.940 15.68 32.15 63 80 ? c - 21.13 - 10.54 24.29 0.16 1.049 15.72 32.02 68 100 ? c - 21.11 - 10.53 24.15 0.18 1.193 15.74 31.90 72 rf performance with voltage change rf performance with operating temperature
4 / 4 www.asb.co.kr a ugust 2017 p lerow tm aln2575t1 internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc supply status. 2) so - called dc blocking capacitors are al ways necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e quency. copyright ? 2009 - 2017 asb inc. all rights reserved. datasheet subject to change without notice. asb assume s no re- sponsibility for any errors which may appear in this datasheet. no part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of asb. application circuit recommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln - at, bt, t series C 10x10mm)
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